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author:

Zhang, D. (Zhang, D..) [1] | Zhu, D.-Y. (Zhu, D.-Y..) [2] | Zhang, T. (Zhang, T..) [3] | Wang, Q.-F. (Wang, Q.-F..) [4]

Indexed by:

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Abstract:

In order to reveal the physical essence of the spreading process of reactive wetting, a sort of model of energy to explain the driving force and wetting mechanism was presented. The reactive wetting of molten Al and Cu-Si on graphite was studied by a modified sessile drop method under a vacuum, in which the contact angles were measured by ADSA software. The thermodynamic and kinetic processes of the typical reactive wetting were focused on, the thermodynamic equations of energy relations were derived, the interfacial energy of graphite and solid-liquid interfacial energy versus time at the triple line were calculated, and the dynamics model of interface energy is established. The presented dynamics model is verified by means of experimental results, and it is shown that solid-liquid interfacial energy decreases with time in exponential relationship. It provides a new method for reference to explain the process from the angle of energy. © 2015 The Nonferrous Metals Society of China.

Keyword:

contact angle; graphite; interface reaction; reactive wetting; solid-liquid interfacial energy

Community:

  • [ 1 ] [Zhang, D.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 2 ] [Zhu, D.-Y.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 3 ] [Zhang, T.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 4 ] [Wang, Q.-F.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China
  • [ 5 ] [Wang, Q.-F.]College of Mechanical and Energy Engineering, Jimei University, Xiamen, 361000, China

Reprint 's Address:

  • [Zhu, D.-Y.]College of Materials Science and Engineering, Fuzhou UniversityChina

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Source :

Transactions of Nonferrous Metals Society of China (English Edition)

ISSN: 1003-6326

Year: 2015

Issue: 7

Volume: 25

Page: 2473-2480

1 . 3 4

JCR@2015

4 . 7 0 0

JCR@2023

ESI HC Threshold:335

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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