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author:

Oyama, H.T. (Oyama, H.T..) [1] | Abe, S. (Abe, S..) [2]

Indexed by:

Scopus

Abstract:

Biobased, biocompatible, and biodegradable poly(lactic acid), PLA, possesses unique properties that give it high potential for a wide range of applications. However, its low thermal stability and brittleness are major obstacles for its use. In this study, both the thermal stability and toughness of PLA were simultaneously improved via stereocomplexation and reactive blending, by generating alloys composed of two PLA enantiomers, PLLA and PDLA, together with poly(ethylene-ran-methylacrylate-ran-glycidyl methacrylate), EMA-GMA. It was found that reactive blending at 200 °C was very effective in generating alloys with high degrees of stereocomplex (sc) crystallinity and that the interfacial reaction between PLA and EMA-GMA contributed to a significant improvement in toughness. Most importantly, a (40/40/20)PLLA/PDLA/EMA-GMA film with high sc crystallinity exhibited both much higher tensile impact strength and thermal stability than neat PLLA, retaining high storage modulus up to 210 °C. The scPLA alloys also exhibited superior chemical resistance to neat PLA. Thus, it was demonstrated that simultaneous complexation and the interfacial reaction transform PLA to the level of high performance materials. © 2015 American Chemical Society.

Keyword:

Heat resistance; Interfacial reaction; Poly(lactic acid); Stereocomplex; Toughness

Community:

  • [ 1 ] [Oyama, H.T.]Department of Chemistry, Rikkyo University, 3-34-1 Nishi-Ikebukuro, Toshima-ku, Tokyo 171-8501, Japan
  • [ 2 ] [Oyama, H.T.]School of Chemical Engineering, Fuzhou University, No. 2 Xueyuan Rd, Minhou County, Fuzhou, 350116, China
  • [ 3 ] [Abe, S.]Department of Chemistry, Rikkyo University, 3-34-1 Nishi-Ikebukuro, Toshima-ku, Tokyo 171-8501, Japan

Reprint 's Address:

  • [Oyama, H.T.]Department of Chemistry, Rikkyo University, 3-34-1 Nishi-Ikebukuro, Japan

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Source :

ACS Sustainable Chemistry and Engineering

ISSN: 2168-0485

Year: 2015

Issue: 12

Volume: 3

Page: 3245-3252

5 . 2 6 7

JCR@2015

7 . 1 0 0

JCR@2023

ESI HC Threshold:265

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 57

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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