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author:

Tang, Q.-H. (Tang, Q.-H..) [1] | Dai, P.-Q. (Dai, P.-Q..) [2]

Indexed by:

Scopus PKU CSCD

Abstract:

The evolution of microstructure and grain orientation of CoCrFeMnNi high entropy alloy during tensile deformation were investigated using electron backscatter diffraction technology. The results show that the original microstructure exhibits equiaxed grain morphology and possesses annealing twinning in the equiaxed grain interior, while the tensile deformation makes equiaxed grains be elongated and results in quick formation of low angle grain boundaries mainly distributed around the twinning boundaries and high angle grain boundaries. During tensile deformation at room temperature which is coordinated through dislocation glide, the grain orientation rotations are inhomogeneous, but the matrix and twinning within individual grain rotate along approximately similar tendency. For matrices, the tensile axes close to <112> and <111> rotate toward <111> following Taylor model; the tensile axes close to <101> and close to middle in the stereographic triangle rotate to the line of <001>-<111> following Sachs model; the tensile axes close to <001> rotate without any significant regularities. © 2016, Editorial Board of Journal of Plasticity Engineering. All right reserved.

Keyword:

Electron backscatter diffraction technology; High-entropy alloy; Microstructure; Orientation rotation; Uniaxial tension

Community:

  • [ 1 ] [Tang, Q.-H.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 2 ] [Dai, P.-Q.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 3 ] [Dai, P.-Q.]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350116, China

Reprint 's Address:

  • 戴品强

    [Dai, P.-Q.]College of Materials Science and Engineering, Fuzhou UniversityChina

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Source :

Journal of Plasticity Engineering

ISSN: 1007-2012

CN: 11-3449/TG

Year: 2016

Issue: 1

Volume: 23

Page: 99-103

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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