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author:

Suo, Y. (Suo, Y..) [1] | Zhang, Z. (Zhang, Z..) [2] | Yang, X. (Yang, X..) [3]

Indexed by:

Scopus

Abstract:

In this paper, taking into account the external loading, growth strain, creep, and bending deformation during the metallic high-temperature oxidation, a residual stress evolution model is developed according to the force- and moment-equilibrium equations. In this model, oxidation kinetic relationship (the stress-dependent growth rate) is related to the stress in the oxide scale, not classical parabolic law. If and only if the stress in the scale or the activation volume is equal to zero, this relationship can reduce to the parabolic law. Then the stress-dependent oxidation kinetics is compared with the stress-independent one (the parabolic law). Finally, effects of the external loading on the stress distribution in the oxide scale, the curvature of the system and the scale thickness are discussed, and numerical results show that the tensile external loading decreases the oxidation stress and promotes the growth rate of the oxidation layer. © Copyright Materials Research Society 2016.

Keyword:

creep deformation; external loading; high temperature oxidation; residual stress; stress-dependent growth rate

Community:

  • [ 1 ] [Suo, Y.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China
  • [ 2 ] [Suo, Y.]School of Science, Xi'An University of Science and Technology, Xi'an, 710054, China
  • [ 3 ] [Zhang, Z.]School of Science, Xi'An University of Science and Technology, Xi'an, 710054, China
  • [ 4 ] [Yang, X.]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350108, China

Reprint 's Address:

  • [Suo, Y.]School of Mechanical Engineering and Automation, Fuzhou UniversityChina

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Source :

Journal of Materials Research

ISSN: 0884-2914

Year: 2016

Issue: 16

Volume: 31

Page: 2384-2391

1 . 6 7 3

JCR@2016

2 . 7 0 0

JCR@2023

ESI HC Threshold:324

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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