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author:

Chiu, Y.-C. (Chiu, Y.-C..) [1] | Zhang, Z. (Zhang, Z..) [2] | Chen, J.-J. (Chen, J.-J..) [3] | Si, X. (Si, X..) [4] | Liu, R. (Liu, R..) [5] | Tu, Y.-N. (Tu, Y.-N..) [6] | Su, J.-W. (Su, J.-W..) [7] | Huang, W.-H. (Huang, W.-H..) [8] | Wang, J.-H. (Wang, J.-H..) [9] | Wei, W.-C. (Wei, W.-C..) [10] | Hung, J.-M. (Hung, J.-M..) [11] | Sheu, S.-S. (Sheu, S.-S..) [12] | Li, S.-H. (Li, S.-H..) [13] | Wu, C.-I. (Wu, C.-I..) [14] | Liu, R.-S. (Liu, R.-S..) [15] | Hsieh, C.-C. (Hsieh, C.-C..) [16] | Tang, K.-T. (Tang, K.-T..) [17] | Chang, M.-F. (Chang, M.-F..) [18]

Indexed by:

Scopus

Abstract:

Previous SRAM-based computing-in-memory (SRAM-CIM) macros suffer small read margins for high-precision operations, large cell array area overhead, and limited compatibility with many input and weight configurations. This work presents a 1-to-8-bit configurable SRAM CIM unit-macro using: 1) a hybrid structure combining 6T-SRAM based in-memory binary product-sum (PS) operations with digital near-memory-computing multibit PS accumulation to increase read accuracy and reduce area overhead; 2) column-based place-value-grouped weight mapping and a serial-bit input (SBIN) mapping scheme to facilitate reconfiguration and increase array efficiency under various input and weight configurations; 3) a self-reference multilevel reader (SRMLR) to reduce read-out energy and achieve a sensing margin 2 $\times $ that of the mid-point reference scheme; and 4) an input-aware bitline voltage compensation scheme to ensure successful read operations across various input-weight patterns. A 4-Kb configurable 6T-SRAM CIM unit-macro was fabricated using a 55-nm CMOS process with foundry 6T-SRAM cells. The resulting macro achieved access times of 3.5 ns per cycle (pipeline) and energy efficiency of 0.6-40.2 TOPS/W under binary to 8-b input/8-b weight precision. © 1966-2012 IEEE.

Keyword:

AI edge processor; CNN; computing-in-memory (CIM); SRAM

Community:

  • [ 1 ] [Chiu, Y.-C.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 2 ] [Chiu, Y.-C.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 3 ] [Zhang, Z.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 4 ] [Zhang, Z.]Microelectronics and Solid-State Electronics Department, Fuzhou University, Fuzhou, 350108, China
  • [ 5 ] [Chen, J.-J.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 6 ] [Chen, J.-J.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 7 ] [Si, X.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 8 ] [Si, X.]Integrated Circuit Design and Integration System Department, University of Electronic Science and Technology of China (UESTC), Chengdu, 611731, China
  • [ 9 ] [Liu, R.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 10 ] [Liu, R.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 11 ] [Tu, Y.-N.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 12 ] [Tu, Y.-N.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 13 ] [Su, J.-W.]Industrial Technology Research Institute, Hsinchu, Taiwan
  • [ 14 ] [Huang, W.-H.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 15 ] [Huang, W.-H.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 16 ] [Wang, J.-H.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 17 ] [Wang, J.-H.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 18 ] [Wei, W.-C.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 19 ] [Wei, W.-C.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 20 ] [Hung, J.-M.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 21 ] [Hung, J.-M.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 22 ] [Sheu, S.-S.]Industrial Technology Research Institute, Hsinchu, Taiwan
  • [ 23 ] [Li, S.-H.]Industrial Technology Research Institute, Hsinchu, Taiwan
  • [ 24 ] [Wu, C.-I.]Industrial Technology Research Institute, Hsinchu, Taiwan
  • [ 25 ] [Liu, R.-S.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 26 ] [Liu, R.-S.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 27 ] [Hsieh, C.-C.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 28 ] [Hsieh, C.-C.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 29 ] [Tang, K.-T.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 30 ] [Tang, K.-T.]National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 31 ] [Chang, M.-F.]Institute of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan
  • [ 32 ] [Chang, M.-F.]National Tsing Hua University (NTHU), Hsinchu, Taiwan

Reprint 's Address:

  • [Chang, M.-F.]Institute of Electrical Engineering, National Tsing Hua University (NTHU)Taiwan

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Source :

IEEE Journal of Solid-State Circuits

ISSN: 0018-9200

Year: 2020

Issue: 10

Volume: 55

Page: 2790-2801

5 . 0 1 3

JCR@2020

4 . 6 0 0

JCR@2023

ESI HC Threshold:132

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 70

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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