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author:

韩绍华 (韩绍华.) [1] (Scholars:韩绍华) | 薛丁琪 (薛丁琪.) [2]

Indexed by:

EI Scopus PKU CSCD

Abstract:

采用感应加热的方式引燃Ti-Si-C(摩尔比3:1:2)及Ti-Si-C-Al(摩尔比3:1:2:0.1)体系的自蔓延燃烧反应并实现了SiC陶瓷间的连接.通过对不同工艺参数下生成产物中Ti3SiC2相的相对含量的分析,初步优选出最佳工艺参数为50 A感应电流下加热、30 A感应电流下保温30 min以及1 MPa的连接压力,得到的SiC/TSC/SiC和SiC/TSC-Al/SiC接头平均抗剪强度分别为32.9和66.8 MPa.微观结构和成分分析的结果表明,SiC/TSC/SiC及SiC/TSC-Al/SiC接头处均显示出良好的界面结合,无明显气孔或裂纹等缺陷.XRD的物相分析结果表明,SiC/TSC-Al/SiC接头的中间层产物中主要含有Ti3SiC2相及少量TiC和Ti-Si的化合物;而SiC/TSC/SiC接头则主要以TiC为主,这就导致了前者的平均抗剪强度超过了后者的两倍.

Keyword:

SiC Ti3SiC2 原位连接 感应加热

Community:

  • [ 1 ] [韩绍华]福州大学
  • [ 2 ] [薛丁琪]福州大学

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Source :

焊接学报

ISSN: 0253-360X

CN: 23-1178/TG

Year: 2018

Issue: 3

Volume: 39

Page: 61-66

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 2

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