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Abstract：
0.1wt% RE and 0.2wt%~0.8wt% Ni were added into Zn20Sn high-temperature lead-free solders. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt% RE and 0.2wt%~0.8wt% Ni are added into Zn20Sn solder alloys, whereas the liquidus temperature decreases, the wettability and microhardness significantly improve. The solder alloy shows the best wettability and the highest microhardness when the content of RE is 0.1wt% and Ni is 0.4wt%. Ni-containing intermetallic compounds form in solder alloys and the amount of intermetallic compounds gradually increases with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys change markedly. © 2018, Northwest Institute for Nonferrous Metal Research. Published by Elsevier BV. All rights reserved.
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Rare Metal Materials and Engineering
ISSN： 1002-185X
CN： 61-1154/TG
Year： 2018
Issue： 6
Volume： 47
Page： 1860-1865
0 . 3 8 1
JCR@2018
0 . 6 0 0
JCR@2023
ESI Discipline： MATERIALS SCIENCE;
ESI HC Threshold：284
JCR Journal Grade：4
CAS Journal Grade：4
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ESI Highly Cited Papers on the List： 0 Unfold All
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30 Days PV： 2
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