Preparation of hydrogel material for 3D bioprinting - Details

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Abstract：

Hydrogel　is　a　kind　of　three-dimensional　network　polymer　formed　by　chemical　bond　or　physical　cross-linking.　It　is　widely　used　in　the　field　of　biomaterial　because　of　its　good　biocompatibility.　In　this　experiment,　a　gel-based　composite　material　for　3D　bioprinting　was　prepared　using　hyaluronic　acid-methyl　cellulose　(HAMC)　gel　as　carrier　and　nano-hydroxyapatite/collagen　(nHAC).　The　effects　of　gel　formulation　on　gel　process　were　analyzed　by　in　vitro　gel　test,　rheological　analysis,　in　vitro　degradation　and　scanning　electron　microscopy.　The　results　showed　that　HAMC　with　different　mineralized　collagen　concentration　could　be　rapidly　gelatinized　at　37　°C　within　3　min.　The　rheological　experiments　showed　that　the　HAMC-mineralized　collagen　had　shear　thinning　properties　suitable　for　3D　bioprinting.　The　results　showed　that　the　degradation　rate　was　similar　in　the　first　10　days,　but　the　degradation　rate　was　slower　with　the　increase　of　mineralized　collagen　concentration.　The　porous　structure　and　high　porosity　of　the　hydrogel　were　observed　by　scanning　electron　microscopy　(SEM).　The　porous　structure　of　the　cross-linked　sample　was　better.　©　Springer　Nature　Singapore　Pte　Ltd.　2018.

Keyword：

3D bioprinting; Hyaluronic acid; Hydrogels; Methyl cellulose; Mineralized collagen

Community：

[ 1 ] [Yan, J.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 2 ] [Yan, J.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 3 ] [Yan, J.]Tsinghua Redbud Innovation Institute Baodi Tianjin, Tianjin, China
[ 4 ] [Xiao, Y.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 5 ] [Xiao, Y.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 6 ] [Hu, K.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 7 ] [Hu, K.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 8 ] [Hu, K.]Collage of Biological Science and Engineering, Fuzhou University, Fujian, China
[ 9 ] [Pan, S.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 10 ] [Pan, S.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 11 ] [Wang, Y.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 12 ] [Wang, Y.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 13 ] [Zheng, B.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 14 ] [Zheng, B.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 15 ] [Wei, Y.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 16 ] [Wei, Y.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China
[ 17 ] [Li, L.]School of Printing and Packaging Engineering, Beijing Institute of Graphic Communication, Beijing, China
[ 18 ] [Li, L.]Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, China

Reprint 's Address：

[Hu, K.]School of Printing and Packaging Engineering, Beijing Institute of Graphic CommunicationChina

Email：

kunhu@139.com

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Source ：

Lecture Notes in Electrical Engineering

ISSN： 1876-1100

Year： 2018

Volume： 477

Page： 935-941

Language： English

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WoS CC Cited Count：

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

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Chinese Cited Count：

30 Days PV： 2

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