The　adhesive　contact　behavior　between　an　indenter　and　a　single　crystal　copper　substrate　is　performed　to　investigated　based　on　the　EAM(embedded　atomic　method)　and　the　Morse　potentials　and　the　verlet　algorithm.　The　influences　of　velocity　on　the　contact　behavior　and　substrate　deformation　are　studied　and　analyzed.　It　is　found　that　the　single　crystal　copper　material＇s　resist　deformation　level　is　limited　by　low　velocity,　and　more　dislocated　atoms　are　accumulated　under　the　moving　direction　of　indenter　in　higher　velocity.　Moreover,　the　contact　force　presents　a　serrated　increase　trend　because　of　the　atomic　reconstruction,　phase　transition　and　the　atom　dislocation　is　damaged　during　indenting　process.　It　is　seen　obviously　that　chip　volume　is　thickened　by　the　sliding　speed　and　sliding　distance　increase　in　slipping　process.　The　contact　(friction,　normal)　force　and　temperature　on　the　contact　area　plays　a　significant　role　in　the　elastic-plastic　substrate　deformation　during　the　whole　moving　process.　Furthermore,　the　dislocated　band　in　basis　lies　at　the　angle　of　45　degrees　with　the　moving　direction　of　indenter.　©　2015　Trans　Tech　Publications,　Switzerland.