The　damping　characteristics　of　a　packaged　high-g　accelerometer　have　been　investigated　in　this　paper.　Firstly,　a　multi-segments-plates-approximate　(MSPA)　model　on　curved　surface　damping　suitable　for　this　component　has　been　established　to　obtain　the　relationship　between　the　parallel-shift-distance　(PSD)　of　curved　stop　and　the　damping　of　component.　Subsequently,　not　only　the　effect　of　the　PSD　of　curved　protection　but　also　the　impact　of　the　characteristics　of　damping　media　on　the　dynamic　shock　response　of　the　component　has　been　studied　with　ANSYS　FEM　technology.　Results　show　that　the　dynamic　output　responses　of　component　were　in　reality　the　superposition　of　both　the　forced　vibration　under　acceleration　shock　and　the　vibration　of　cantilever　in　its　inherent　frequency.　With　the　increase　of　PSD,　the　inherent　frequency　vibration　became　outstanding　in　output　response　and　both　the　peak　output　voltage　and　displacement　of　beam　end　increased　linearly　whereas　its　corresponding　time　decreased　nonlinearly.　The　effects　of　damping　media　on　the　dynamic　response　characteristics　of　the　component　were　attributed　to　the　difference　of　viscosity　coefficient　of　damping　medium.　Under　the　same　other　conditions,　with　increment　of　viscosity　coefficient,　the　output　response　curve　become　smoother　except　for　lower　peak　voltage.　Therefore,　the　PSD　of　curved　stop　should　be　controlled　between　0.5　and　0.65　μm　during　the　fabrication　of　chip　and　if　the　PSD　was　about　0.5　μm,　air　would　be　the　most　suitable　damping　media　in　the　packaging　of　the　component.　©　2005　Elsevier　Ltd.　All　right　reserved.