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author:

Chen, Junfeng (Chen, Junfeng.) [1] | Zou, Linchi (Zou, Linchi.) [2] | Li, Qiang (Li, Qiang.) [3] | Chen, Yulong (Chen, Yulong.) [4]

Indexed by:

EI

Abstract:

The microstructure evolution of the 7050 Al alloy treated by age-forming was studied using a designed device which can simulate the age-forming process. The grain shape, grain boundary misorientation and grain orientation evolution of 7050 Al alloy during age-forming have been quantitatively characterized by electron backscattering diffraction technique. The results show that age-forming produced abundant low-angle boundaries and elongated grains, which attributed to stress induced dislocation movement and grain boundary migration during the age-forming process. On the other side, the stress along rolling direction caused some unstable orientation grains to rotate towards the Brass and S orientations during the age-forming process. Hence, the intensity of the rolling texture orientation in age-formed samples is enhanced. But this effect decays gradually with increasing aging time, since stress decreases and precipitation hardening occurs during the age-forming process. © 2015 Elsevier Inc. All rights reserved.

Keyword:

Age hardening Aluminum alloys Backscattering Grain (agricultural product) Grain boundaries Textures

Community:

  • [ 1 ] [Chen, Junfeng]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 2 ] [Zou, Linchi]School of Materials Science and Engineering, Fujian University of Technology, Fuzhou; 350118, China
  • [ 3 ] [Li, Qiang]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 4 ] [Chen, Yulong]School of Materials Science and Engineering, Fuzhou University, Fuzhou; 350116, China

Reprint 's Address:

  • [chen, junfeng]school of materials science and engineering, fuzhou university, fuzhou; 350116, china

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Source :

Materials Characterization

ISSN: 1044-5803

Year: 2015

Volume: 102

Page: 114-121

2 . 3 8 3

JCR@2015

4 . 8 0 0

JCR@2023

ESI HC Threshold:335

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 13

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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