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Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integra...

Three-dimensional integrated circuit (3D IC) is a promising technology in today's IC packaging industry. Since the technology is in infancy stages, many...
LJ Ladani  -  被引量:  129  -  2010年
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A new approach to high fidelity e‐beam and ion‐beam lithography based on an in situ global‐fiducial grid

The distortion‐free scan field of an electron‐beam or ion‐beam lithography system is generally quite small (10×10beam addresses) and hence to achiev...
HI SmithSD HectorML Schattenburg , ... -  《Journal of Vacuu...  -  被引量:  127  -  1991年

Novel Approach for Fabrication of Single-Crystalline Insulator/Si/Insulator Nanostructures

Double-barrier insulator/Si/insulator nanostructures on Si(111) were prepared using molecular beam epitaxy. Ultrathin single-crystalline Si buried in a ...
A FisselD KuehneE Bugiel , ... -  《Mrs Online Proce...  -  被引量:  64  -  2006年

Phase-shifting mask fabrication

The choice of a fabrication technique for phase-shifting masks is described by comparing approaches in which the shifter patterns are defined by etching...
C PierratJ Demarco  -  被引量:  47  -  1994年

Advanced nanoscale material processing with focused ion beams

We present an approach for the generation of metallic Ga dots and In nano-crystallites which, in contrast to conventional bottom-up or top-down processe...
A LugsteinB BasnarJ Smoliner , ... -  《Journal of Vacuu...  -  被引量:  15  -  2004年

Molecular Nanoelectronics

In this chapter we intend to discuss the major trends in the evolution of microelectronics and its eventual transition to nanoelectronics. As it is well...
G AllanC DelerueC Krzeminski , ... -  《Physics》  -  被引量:  11  -  2012年

Subwavelength plasmonics for graded-index optics on a chip

Planar plasmonic devices are becoming attractive for myriad applications, owing to their potential compatibility with standard microelectronics technolo...
M GrajowerGM LermanI Goykhman , ... -  《Optics Letters》  -  被引量:  2  -  2013年
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Subwavelength plasmonics for graded-index optics on a chip.

Planar plasmonic devices are becoming attractive for myriad applications, owing to their potential compatibility with standard microelectronics technolo...
MeirGrajowerM Gilad , ... -  《Optics Letters》  -  被引量:  1  -  2013年

An overview of the application of atomic layer deposition process for lithium‐ion based batteries

Summary Abstract Lithium‐ion battery (LIB) systems provide a very promising range of power supply systems for diverse applications like electric vehicl...
EC NwannaS BitirePE Imoisili , ... -  《International Jo...  -  被引量:  0  -  2022年

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